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Customer Care Europe, Middle East & Africa
SCCE Training Group
GENERAL
-How to use this document
Put the colored schematics behind this manual.
Now you are able to follow these specifications with graphical layouts and it is easier for you to find the
components and measuring points.
-Component characteristics:
Some components contain important data.
Several described steps are only practicable if you are able to reflash/ realign the phone and/or rewrite
IMEI/SIMlock in certain cases. Please pay attention to separate notes.
-Broken balls, µBGA
All replaceable µBGA-components must be renewed after removing.
Reflow with hot air fan is strictly forbidden!
Check soldering points, remove oxidated solderings (broken balls) carefully by enclosing few new solder
before placing new components.
µBGA must be soldered only with NMP approved µBGA-rework machines (e.g. Zevac/OK International).
Only use recommended fluxtype and an appropriate amount of it.
-PCB handling & cleaning
To avoid damages of PCB and/or components through electrostatic discharging, handle the module in
ESD-suitable cases only. Always wear ESD-bracelets, which must be connected to earth bonding point.
Do not make any loose wiring connections or do some other unqualified rework anywhere.
For cleaning only use appropriate materials, do not use scratching or rubbing tools.
Because of organic surface protection (OSP) cleaning must only be done with a lint-free cloth, which may
be moistened with DI-water. IPA or other solvent like ethanol should only be used to clean gold pads for
spring contacts without affecting the surrounding copper layers.
-Realign after repair
Characteristics of replacement parts are different.
To prevent additional faults after repair (eg. low standby time, loosing network etc.) it is necessary to retune
phone values after repair. But never try to cover a fault by tuning.
© NMP 2002
CONFIDENTIAL
NHM—2/5/6
3410
Date 20.11.2002
Checked by:
Customer Care E&A
2 (44)
Repairhints
Version 4.0 Approved
Approved by:
SCCE Training Group
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